N301005 FPC Pre-bonding Machine

This machine is specifically designed for pre-bonding and alignment of FPC (Flexible Printed Circuit) to substrates or modules. Using vision guidance and precision pressure control, it achieves high-accuracy pre-bonding, providing reliable positioning for subsequent main bonding processes. Ideal for display modules, touch panels, camera modules, and other precision electronic assembly applications.

Included Documentation:

• ✅ SolidWorks source files (editable)

• Supports structural modifications, pressure parameter adjustments, or line integration changes

Key Features:

• Dedicated to FPC pre-bonding process

• Vision-guided alignment with high accuracy

• Adjustable pressure and stroke for different products

• Compact modular design for easy integration into existing lines

• Complete editable 3D source files included

Applications:
Display module FPC pre-bonding, touch panel pre-bonding before main bonding, camera module flexible circuit assembly

📁 This product comes with editable SolidWorks source files for technical evaluation, structural modification, and line adaptation.